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本期内容
2024年 4/5 月刊
封面故事 Cover Story
利用USACH BoulePro-200AX为SiC行业制定标准
Setting standards in the SiC industry with the USACH BoulePro-200AX
编者话 Editorial
AI开启半导体行业新纪元
AI ushers in a new era for the semiconductor industry
业界动态 Industry
SEMI 报告: 
2023年全球半导体设备出货金额为1063亿美元
SEMI Report: The global semiconductor equipment shipment value reached 106.3 billion US dollars in 2023
SK siltron 获美国7700万美元支持扩建SiC晶圆厂
SK Siltron Receives $77 Million in U.S. Support for SiC Wafer Factory Expansion
Luminus 推出首批激光器产品
Luminus launches its first laser products
格芯GaN晶圆厂将受益于15亿美元的《芯片与科学法案》资金
GF GaN fab to benefit from $1.5B CHIPS Act funding
苹果microLED手表计划摇摆不定
Apple microLED watch plans falter
Wolfspeed报告称第二季度设计采纳创下新高
Wolfspeed reports record design wins in Q2
化合物半导体产业全新风向标-2024 九峰山论坛暨化合物半导体产业博览会圆满落幕
The Compound Semiconductor Industry's New Benchmark - The 2024 JSF Forum and Compound Semiconductor Industry Expo Concluded Successfully
宽禁带半导体国家工程研究中心专栏 WBS Column
氮化镓毫米波功率器件与电路研究进展
Research Progress on Gallium Nitride Millimeter-Wave Power Devices and Circuits
科技前沿 Research Review
低温热氧化与自对准刻蚀工艺结合制备了8.7A@2V/700V氧化镓功率 半导体器件
Low-temperature thermal oxidation combined with self-aligned etching technology was used to fabricate gallium oxide power semiconductor devices with a breakdown voltage of 8.7A at 2V/700V
加深对沟槽后修复工作的理解
Deepening the understanding of post-trench restoration
技术 Technology
“万能离子刀”技术为8英寸SiC提供低成本方案
"Universal Ion Blade" Technology Provides a Cost-Effective Solution for 8-inch SiC
扩展高速VCSEL的应用范围
Extending the reach of high-speed VCSELs
多维功率器件
Multi-dimensional power devices
SiC超结的一种卓越工艺
A superior process for the SiC superjunction
一种削减成本的合理方法
A sound approach to cutting costs
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